-
Notifications
You must be signed in to change notification settings - Fork 0
Expand file tree
/
Copy pathcase_study_cooling_decision.py
More file actions
255 lines (211 loc) · 11.4 KB
/
Copy pathcase_study_cooling_decision.py
File metadata and controls
255 lines (211 loc) · 11.4 KB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
#!/usr/bin/env python3
"""
Case Study: The Cooling Upgrade That Wouldn't Help.
SCENARIO:
A data center architecture team is designing the next-generation AI
accelerator on a 5 nm process at 1.5 GHz. Their current silicon die uses
standard server air cooling (h = 1,000 W/m²K). Compute density is at the
thermal limit — they can't pack more gates without overheating.
The team is evaluating two options:
Option A: Upgrade to direct liquid cooling (h = 20,000 W/m²K).
Cost: ~$2M for a 10,000-unit data center retrofit.
Option B: Stay with air cooling but switch the substrate to SiC.
Cost: higher per-die cost, but no data center retrofit.
Management wants to know: which option unlocks more compute density?
NON-OBVIOUS CONCLUSION:
Option A (expensive liquid cooling) improves maximum density by only 0.3%.
Option B (SiC substrate with the same cheap air cooling) improves it by 232%.
The reason is the conduction floor — an irreducible thermal resistance set
by the substrate's thermal conductivity. On silicon, heat cannot leave the
die fast enough regardless of how aggressively you cool the surface. No
amount of convective cooling can overcome this physics.
Aethermor surfaces this conclusion in under 15 seconds. Without it, the
team would need to set up and run separate COMSOL models for each material
and cooling configuration — typically 1-2 days of engineering time.
BONUS INSIGHT:
Even without changing the substrate or cooling, the team can gain 47% more
throughput by redistributing compute density from the thermally-bottlenecked
GPU block to the thermally-underutilized cache and I/O blocks. The L3 cache
has 26x thermal headroom. The I/O complex has 14x. The GPU is at the wall.
The power budget (200 W) is not even close to binding — only 10 W is used.
The constraint is thermal, not electrical. This is invisible without a tool
that models both power and thermal simultaneously.
RUN IT:
python benchmarks/case_study_cooling_decision.py
"""
import sys
import os
import time
sys.stdout.reconfigure(encoding="utf-8", errors="replace")
from aethermor.analysis.thermal_optimizer import ThermalOptimizer
from aethermor.physics.chip_floorplan import ChipFloorplan, FunctionalBlock
from aethermor.physics.materials import get_material
# ── Configuration ─────────────────────────────────────────────────────
TECH_NODE = 5 # nm
FREQ = 1.5e9 # Hz
H_AIR = 1000.0 # server air cooling, W/(m²·K)
H_LIQUID = 20000.0 # direct liquid cooling, W/(m²·K)
H_EXOTIC = 50000.0 # exotic direct-die cooling, hypothetical upper bound
opt = ThermalOptimizer(tech_node_nm=TECH_NODE, frequency_Hz=FREQ)
# ══════════════════════════════════════════════════════════════════════
print("=" * 72)
print("CASE STUDY: The Cooling Upgrade That Wouldn't Help")
print("=" * 72)
print()
print(f" Scenario: {TECH_NODE} nm AI accelerator at {FREQ/1e9:.1f} GHz")
print(f" Current cooling: server air (h = {H_AIR:.0f} W/m²K)")
print(f" Question: upgrade to liquid cooling, or change substrate?")
print()
# ── Part 1: Cooling upgrade barely helps on silicon ───────────────────
print("-" * 72)
print("PART 1: How much does better cooling actually buy on silicon?")
print("-" * 72)
t0 = time.perf_counter()
si_air = opt.find_max_density("silicon", h_conv=H_AIR)
si_liquid = opt.find_max_density("silicon", h_conv=H_LIQUID)
si_exotic = opt.find_max_density("silicon", h_conv=H_EXOTIC)
elapsed_1 = time.perf_counter() - t0
gain_liq = (si_liquid["max_density"] - si_air["max_density"]) / si_air["max_density"] * 100
gain_exo = (si_exotic["max_density"] - si_air["max_density"]) / si_air["max_density"] * 100
print(f"\n Computed in {elapsed_1:.1f}s\n")
print(f" {'Cooling Solution':<30s} {'h (W/m²K)':>12s} {'Max Density':>14s} {'Gain vs Air':>12s}")
print(f" {'-'*30} {'-'*12} {'-'*14} {'-'*12}")
print(f" {'Server air (current)':<30s} {H_AIR:>12,.0f} {si_air['max_density']:>14.3e} {'baseline':>12s}")
print(f" {'Direct liquid ($2M retrofit)':<30s} {H_LIQUID:>12,.0f} {si_liquid['max_density']:>14.3e} {gain_liq:>11.1f}%")
print(f" {'Exotic direct-die (theoretical)':<30s} {H_EXOTIC:>12,.0f} {si_exotic['max_density']:>14.3e} {gain_exo:>11.1f}%")
print()
print(f" ⚠ RESULT: 20× more aggressive cooling buys only {gain_liq:.1f}% more density.")
print(f" Even a 50× cooling upgrade (exotic direct-die) gains only {gain_exo:.1f}%.")
print()
print(f" WHY: Silicon's thermal conductivity (148 W/mK) creates an irreducible")
print(f" conduction floor. Heat cannot leave the die interior fast enough,")
print(f" regardless of how aggressively the surface is cooled.")
# ── Part 2: Substrate switch is transformative ────────────────────────
print()
print("-" * 72)
print("PART 2: What if we change the substrate instead?")
print("-" * 72)
t0 = time.perf_counter()
materials = ["silicon", "silicon_carbide", "gallium_nitride", "diamond"]
ranking = opt.material_ranking(h_conv=H_AIR, materials=materials)
elapsed_2 = time.perf_counter() - t0
si_d = si_air["max_density"]
print(f"\n Computed in {elapsed_2:.1f}s (same server air cooling for all)\n")
print(f" {'Substrate':<25s} {'k (W/mK)':>10s} {'Max Density':>14s} {'vs Silicon':>12s} {'vs Si+Liquid':>14s}")
print(f" {'-'*25} {'-'*10} {'-'*14} {'-'*12} {'-'*14}")
for r in ranking:
mat = get_material(r["material"])
ratio_si = r["max_density"] / si_d
ratio_liq = r["max_density"] / si_liquid["max_density"]
marker = ""
if r["material"] == "silicon":
marker = " (baseline)"
print(f" {r['material_name']:<25s} {mat.thermal_conductivity:>10.0f} {r['max_density']:>14.3e}"
f" {ratio_si:>11.1f}× {ratio_liq:>13.1f}×{marker}")
sic = next(r for r in ranking if r["material"] == "silicon_carbide")
sic_gain_pct = (sic["max_density"] - si_d) / si_d * 100
sic_vs_liquid = sic["max_density"] / si_liquid["max_density"]
print()
print(f" ✓ RESULT: SiC with basic air cooling gives {sic_gain_pct:.0f}% more density than")
print(f" silicon with the same air cooling — and {sic_vs_liquid:.1f}× more than silicon")
print(f" with the $2M liquid cooling upgrade.")
print()
print(f" THE DECISION: Don't retrofit the data center. Change the substrate.")
print(f" SiC + air ≫ Si + liquid. The physics makes this unambiguous.")
# ── Part 3: Free throughput from compute redistribution ───────────────
print()
print("-" * 72)
print("PART 3: What can we gain for FREE right now? (no hardware changes)")
print("-" * 72)
# Build a representative SoC
fp = ChipFloorplan(
grid_shape=(40, 40, 6),
element_size_m=50e-6,
material="silicon",
)
fp.add_block(FunctionalBlock(
name="GPU_cluster", x_range=(0, 25), y_range=(0, 25), z_range=(0, 6),
gate_density=1e4, activity=0.6, tech_node_nm=TECH_NODE, paradigm="cmos",
))
fp.add_block(FunctionalBlock(
name="L3_cache", x_range=(25, 40), y_range=(0, 25), z_range=(0, 6),
gate_density=8e3, activity=0.03, tech_node_nm=TECH_NODE, paradigm="cmos",
))
fp.add_block(FunctionalBlock(
name="IO_complex", x_range=(0, 40), y_range=(25, 40), z_range=(0, 6),
gate_density=2e3, activity=0.15, tech_node_nm=TECH_NODE + 2, paradigm="cmos",
))
# Headroom analysis
t0 = time.perf_counter()
headroom = opt.thermal_headroom_map(fp, h_conv=H_AIR)
elapsed_3a = time.perf_counter() - t0
print(f"\n Thermal headroom analysis (computed in {elapsed_3a:.3f}s):\n")
print(f" {'Block':<20s} {'T_max (K)':>10s} {'Headroom':>10s} {'Status':>15s}")
print(f" {'-'*20} {'-'*10} {'-'*10} {'-'*15}")
for h in headroom:
hf = h.get("density_headroom_factor", 0)
if h.get("is_bottleneck"):
status = "← BOTTLENECK"
elif hf > 10:
status = f"← {hf:.0f}× underused"
else:
status = ""
print(f" {h['name']:<20s} {h['T_max_K']:>10.1f} {hf:>10.1f}× {status:>15s}")
# Power redistribution
t0 = time.perf_counter()
result = opt.optimize_power_distribution(
fp, power_budget_W=200.0, frequency_Hz=FREQ, h_conv=H_AIR
)
elapsed_3b = time.perf_counter() - t0
print(f"\n Power-constrained optimization (computed in {elapsed_3b:.3f}s):\n")
if "optimised_blocks" in result:
print(f" {'Block':<20s} {'Original':>12s} {'Optimised':>12s} {'Change':>10s}")
print(f" {'-'*20} {'-'*12} {'-'*12} {'-'*10}")
for br in result["optimised_blocks"]:
change = br.get("density_change", 1)
arrow = "↑" if change > 1.01 else ("↓" if change < 0.99 else "=")
print(f" {br['name']:<20s} {br['original_density']:>12.0f} "
f"{br['optimised_density']:>12.0f} {arrow} {change:>8.1f}×")
improvement = result.get("improvement_ratio", 1)
total_power = result.get("total_power_W", 0)
power_budget = result.get("power_budget_W", 200)
binding = result.get("binding_constraint", "unknown")
print()
print(f" Throughput improvement: {improvement:.2f}× ({(improvement - 1) * 100:.0f}%)")
print(f" Power used: {total_power:.1f} W of {power_budget:.0f} W budget")
print(f" Binding constraint: {binding}")
print()
print(f" ✓ RESULT: {(improvement - 1) * 100:.0f}% more throughput with ZERO hardware changes.")
print(f" The L3 cache block has massive thermal headroom — the optimizer shifts")
print(f" compute density there, pulling it from the thermally-limited GPU block.")
print()
print(f" CRITICAL INSIGHT: The power budget ({power_budget:.0f} W) is not the constraint.")
print(f" Only {total_power:.1f} W of {power_budget:.0f} W is used — the binding constraint is THERMAL.")
print(f" Adding more electrical power capacity does nothing. The physics bottleneck")
print(f" is heat removal from the die interior, not power delivery to it.")
# ── Summary ───────────────────────────────────────────────────────────
total_time = elapsed_1 + elapsed_2 + elapsed_3a + elapsed_3b
print()
print("=" * 72)
print("SUMMARY: Three Non-Obvious Engineering Conclusions")
print("=" * 72)
print(f"""
1. COOLING UPGRADES DON'T HELP ON SILICON.
Spending $2M on liquid cooling buys {gain_liq:.1f}% more density.
The conduction floor makes this nearly zero-return.
2. SUBSTRATE CHANGE IS 700× MORE EFFECTIVE THAN COOLING CHANGE.
SiC + cheap air cooling gives {sic_gain_pct:.0f}% gain vs Si + air.
Si + expensive liquid cooling gives {gain_liq:.1f}% gain vs Si + air.
Ratio: {sic_gain_pct / max(gain_liq, 0.001):.0f}× more effective.
3. COMPUTE REDISTRIBUTION GIVES {(improvement - 1) * 100:.0f}% FOR FREE.
The GPU block is at the thermal wall. The cache block has {headroom[1].get('density_headroom_factor', 0):.0f}×
headroom. Redistributing density improves throughput {improvement:.2f}×
without changing the substrate, cooling, or power budget.
WHAT THE ENGINEER WOULD HAVE DONE WITHOUT THIS DATA:
Ordered the liquid cooling retrofit. Lost $2M. Gained 0.3%.
WHAT THIS TOOL SHOWS IN {total_time:.0f} SECONDS:
Skip the cooling upgrade. Either switch to SiC or just
redistribute compute density across blocks for immediate gains.
This is the kind of insight that changes an engineering decision —
and the reason architecture-stage thermal exploration matters.
""")