tl_platform_sdk is a software development kit for Telink IoT and audio chips, designed for RISC-V series chips. It provides unified abstract interfaces and underlying software support for chips. It serves as the core software layer connecting hardware platforms with upper-layer application SDKs.
The SDK mainly includes the following software components:
- Chip peripheral drivers
- Basic communication components
- Startup software and link scripts
- Rich examples
Supported Chip Series
tl_platform_sdk applies to chips based on the RISC-V architecture. For the supported chip series, as well as the modules, EVBs, development platforms, toolchain versions, and SDK download methods currently supported by the SDK, refer to the Release Notes.
Related documents
| Documentation | Description |
|---|---|
| Get Started | Configuring the development environment, obtaining the SDK, and getting started |
| Telink Driver SDK Handbook | Detailed description of software architecture, repository structure and functional modules |
| Release Notes | Supported platforms, SDK versions, and detailed changes |
Related resources
| Resources | Description |
|---|---|
| Telink Official Website | Product Types and Applications |
| Telink Documentation Website | Documentation Center |
| Telink Official Forum | Technical support and discussion |
| SDK source code repository | Gitee GitHub |
| Examples | Examples and usage instructions |
The project adopts the following permits:
Apache License, Version 2.0
Licensed under the Apache License, Version 2.0 the License;
You may not use this file except in compliance with the License.
You may obtain a copy of the License at:
http://www.apache.org/licenses/LICENSE-2.0
Unless required by applicable law or agreed to in writing, software distributed under the License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied.
See the License for the specific language governing permissions and limitations under the License.