Conversation
* mechanical: give the end plates a Blue soldermask stackup The end-plate PCBs had no physical stackup, so KiCad exported them with the default green soldermask. Add a 2-layer stackup with front/back mask set to the named "Blue" preset, summing to the existing 1.6 mm so board thickness / fit is unchanged. This makes the plates export blue-dominant so the viewer's soldermask recolour treats them the same as the main board. * feat(viewer): part toggles, upright orientation, Turn Island navy, even lighting Grow the mechanical fit-check viewer into an interactive, correctly-coloured one: - Part toggles: show/hide enclosure, main board, front/rear end plate. Rebuilt on pinned three.js r148 (model-viewer has no per-node visibility API); a checkbox flips object.visible on each part's prefixed nodes. Libraries inlined via a runtime import map -- no bundler, fully offline. - Upright orientation (180 deg roll), click-to-set-pivot, and a header showing the git hash and branch as links (new --repo-url, fed from the CI environment). - Board colour: assemble_glb recolours the blue soldermask to the Turn Island navy (KiCad's "Blue" preset exports a brighter cornflower); detection targets only the matte, blue-dominant mask material. The material is identical on every face, so the viewer lighting is set to an orientation-independent rig (soft key + strong ambient + damped environment) so every face reads the same navy. - Checkbox reload-sync: autocomplete="off" + re-apply each box's state on load so the model always matches the checkboxes after a refresh. Colour is applied downstream of KiCad (in the assembler) rather than as a custom hex stackup colour, because the pinned KiBot image does not accept hex soldermask colours; the KiCad stackup stays on the named "Blue" preset. The board STEP therefore still carries KiCad's plain colour -- STEP and viewer intentionally differ for now.
added 4 commits
July 28, 2026 20:19
Full-severity ERC/DRC surfaced 22 lib_symbol_mismatch + 5 lib_footprint_mismatch warnings from cached copies drifting off the library master. Reconciled and verified against the schematic and board: - Symbol caches: refresh 8 cap/diode symbols whose embedded footprint field was stale (PAD_0603 -> C_0603); instances and PCB already used C_0603. - SMA (J1-J4): push the board's tuned 3D-model offset/rotate into the library master and re-save it in KiCad 10 format; fix J1 LCSC C2874826 -> C914558 in schematic and board (J1 was an error, not a variant). - U.FL (J10): re-save library footprint in v10 to match the routed board. Result: ERC 0, DRC 0 (errors + warnings).
…uVia to regular drill transition
…urtyard requirement
This file contains hidden or bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
Sign up for free
to join this conversation on GitHub.
Already have an account?
Sign in to comment
Add this suggestion to a batch that can be applied as a single commit.This suggestion is invalid because no changes were made to the code.Suggestions cannot be applied while the pull request is closed.Suggestions cannot be applied while viewing a subset of changes.Only one suggestion per line can be applied in a batch.Add this suggestion to a batch that can be applied as a single commit.Applying suggestions on deleted lines is not supported.You must change the existing code in this line in order to create a valid suggestion.Outdated suggestions cannot be applied.This suggestion has been applied or marked resolved.Suggestions cannot be applied from pending reviews.Suggestions cannot be applied on multi-line comments.Suggestions cannot be applied while the pull request is queued to merge.Suggestion cannot be applied right now. Please check back later.
What this is
Second bring-over tranche from
ringof/dev, catching TAPR up to ringof'simproved state. Follows tranche 1 (the initial flatten + PCB CI, already on
main/v0.6). Imported as-is fromringof/devexcept one adaptation.Included
Front_End+refclk), PCB, andproject settings, verbatim from
ringof/dev.3d/scheme; adds
HamSCI-25mmandSMA_Jack_EdgeMount_JLC_With_Nut; dropsSMA-RA-Jack(SMA connector swap).3d/tree (kicad-stock/mirror + custom models), so STEPand 3D renders resolve with no external
${TIS}.mechanical/(enclosure,endplate-front/-rearprojects,hardware STEPs) +
assemble_mechanical/assemble_glb/make_3d_viewer/build_endplates.mechanical-ci+ reusablemechanical-build+endplate-release;updated
dev-release/main-release; plus a hard gate socheck_3d_modelsfails the job on any legacy/absolute 3D path regardless of
ENFORCE.RELEASE_STRATEGY+ runbooks +README/CLAUDE/CONTRIBUTING/VERSION.txt.Adaptation (ringof → TAPR)
Only content change vs
ringof/dev: the GitHub Pages URLringof.github.io/TAPRx888→tapr.github.io/TAPRx888(5 files).Validation (local first, then CI on
design)check_3d_models.py --require-local— clean (no legacy refs; all board-usedmodels present).
local-override warnings).
self-contained viewer HTML.
dev-checks+mechanical-cigreen ondesign.On merge
dev-releasewill cut av0.xpre-release (design files changed). This is apre-release only — production
v1.0is a separate, deliberatedev → mainstep.No version numbers are committed to the tree.
Related issues
Closes #53. Addresses #28, #29. Touches #25 (SMA part) and #43 (J10 U.FL local
override). The design-fix issues (#31, #32, #34–#39, #45) should be reconciled
against the actual ERC/DRC reports post-merge — not assumed fixed.