Repository navigation
Conversation
Squashes the eight commits of pull request 18 onto the current main: module, package, bank array and bank scales, with sources and tests.
The module, package and diagrams from #18 were rebuilt against data sheets: - Module: one extruded board outline with a real key, latch notches and, on DDR4, the curved contact edge; 288 contacts at the JEDEC 0.85 mm pitch; the published height and thickness with the spreader; PMIC, inductors and SPD hub on DDR5, SPD EEPROM and fly-by termination on DDR4; separate front and back plates with locking clips and pads. - Package: the board-on-chip FBGA both generations use, die face down over a slot in the substrate, centre pads, bond wires, encapsulant and the 78-ball 13 x (3 + 3) grid it leaves room for. - Die: bank groups with their own I/O, 32 banks (DDR5) or 16 (DDR4), and the centre-stripe periphery: command, mode registers, refresh, on-die ECC or DLL, prefetch, data I/O and ZQ. - Bank: mats, local sense-amplifier stripes, sub-wordline drivers, global wordlines and bitlines, decoders and bank control. - New cell scale: wordlines, bitlines, access transistors, charged and empty capacitors under the plate, precharge, sense amplifiers, column select and local I/O. The DDR4 module (FURY Beast DDR4-3200) sits beside the installed DDR5 one in the Memory menu, each in its own dropdown, and the pair forms a Memory group in the comparison workbench. The motherboard now carries the complete DDR5 model in its slots, keyed from the module's own key.
DDR4 now dives as deep as DDR5. Its bank and cell scales are the DDR5 ones under ddr4 ids with the numbers that differ swapped in: a 17-bit row address and 131,072 rows per bank, 64 bits per column access, and wordlines boosted to 2.5 V instead of 1.8 V. The comparison sheet gains a Bank and cell row saying the same. The spreader and pads no longer flicker as the camera moves. The interlock and the pads shared faces with the plates and with each other; they now stop short of them. The locking clips sit inside the plates' outline instead of standing off the edge as tabs, the wordmark is printed on the plate rather than floating at ridge height, and the back tape fills the gap to the laminate and leaves downward with the back plate instead of rising through the board.
|
The latest updates on your projects. Learn more about Vercel for GitHub.
|
This branch was previously deployed
This file contains hidden or bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
Sign up for free
to join this conversation on GitHub.
Already have an account?
Sign in to comment
Add this suggestion to a batch that can be applied as a single commit.This suggestion is invalid because no changes were made to the code.Suggestions cannot be applied while the pull request is closed.Suggestions cannot be applied while viewing a subset of changes.Only one suggestion per line can be applied in a batch.Add this suggestion to a batch that can be applied as a single commit.Applying suggestions on deleted lines is not supported.You must change the existing code in this line in order to create a valid suggestion.Outdated suggestions cannot be applied.This suggestion has been applied or marked resolved.Suggestions cannot be applied from pending reviews.Suggestions cannot be applied on multi-line comments.Suggestions cannot be applied while the pull request is queued to merge.Suggestion cannot be applied right now. Please check back later.
Closes #5. Supersedes #18: its commits are included here, squashed and rebased onto main with @CL-BAF kept as author.
DDR5 (Kingston FURY Beast DDR5-6000 16 GB, installed) and DDR4 (FURY Beast DDR4-3200 16 GB, alternative), each diving module → package → die → bank → cell, each in its own dropdown under Memory.
38 scales, 421 concepts, 73 sources.
tsc, 84 tests, lint, format and build pass; every new scale was rendered and checked in a headless browser. ARCHITECTURE.md, README.md, SOURCES.md and the reference index are updated.